CN

Laser Bump Component

Our component sockets can be suitable for almost all semiconductor packages, and can effectively avoid: high-temperature soldering, electrostatic discharge, and the damage caused by cleaning solution ; bad solder joints, broken contacts caused by poor contact; material damage and labor costs during replacement; line vacancy caused by lead time; noise caused by overheating of welding, etc. There are also many types of special sockets with heat sinks that match the heating device, and the ultra-thin type that does not affect the optical and mechanical structure. Please call for details.

Our component sockets can be suitable for almost all semiconductor packages, and can effectively avoid: high-temperature soldering, electrostatic discharge, and the damage caused by cleaning solution ; bad solder joints, broken contacts caused by poor contact; material damage and labor costs during replacement; line vacancy caused by lead time; noise caused by overheating of welding, etc. There are also many types of special sockets with heat sinks that match the heating device, and the ultra-thin type that does not affect the optical and mechanical structure. Please call for details.
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